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Precision coating protective materials

Protective film for wafer dicing

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    Product Description

    •  Suitable for surface protection when cutting LED semiconductor chips;


    •  Used to prevent stainless steel plates, aluminum plates, and nameplates from being damaged during processing;


    •  Used to protect materials such as glass and aluminum window frames.



    Product Features

    •  Long-lasting adhesion without adhesive residue;


    •  Resistant to high temperatures;



    •  Excellent process ability.



    Product Structure Diagram

    Product Parameters

    Application Area