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Precision coating bonding materials

Semiconductor Packaging Engineering Tape

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    Product Description

    •   Heat-resistant re-peelable adhesive tape


    •  Excellent heat resistance, extensively applied in various fields.



    Product Features

    •   Semi-conductivity (low resistivity), overload protection, stable temperature performance (130℃/266F), excellent compatibility with various cables and conductors.


    •   Easy to stretch, good conformability on irregular surfaces.


    •   Resistant to solvents, UV rays, and moisture


    •   Customizable as per customer demand, strong viscosity before UV irradiation, which is significantly reduced after UV irradiation for easy peel-off


    •   Excellent machinability in wafer cutting and protection


    Product Structure Diagram

    Product Parameters

    Application Area

    • Surface protection for LED semiconductor chip dicing
    • Semiconductor or LED packaging protection