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Kosdak stock code：900290

Precision coating bonding materials

Semiconductor Packaging Engineering Tape

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Product Description

• Heat-resistant re-peelable adhesive tape

• Excellent heat resistance, extensively applied in various fields.

Product Features

• Semi-conductivity (low resistivity), overload protection, stable temperature performance (130℃/266F), excellent compatibility with various cables and conductors.

• Easy to stretch, good conformability on irregular surfaces.

• Resistant to solvents, UV rays, and moisture

• Customizable as per customer demand, strong viscosity before UV irradiation, which is significantly reduced after UV irradiation for easy peel-off

• Excellent machinability in wafer cutting and protection

Product Structure Diagram

Product Parameters

Application Area

Surface protection for LED semiconductor chip dicing
Semiconductor or LED packaging protection