• This product can be used for cutting protection of electronic components, SMT components, glass, wafers, ceramics, lens chips, etc., to ensure that the chips do not fall off, scatter, or expand, preventing fragmentation and back collapse.
Product Features
• Precise coating control technology, stable product thickness, and mechanical properties, etc.; • PET, PO and other substrates used, coated with UV glue, supporting design before and after adhesion • Quick response to UV irradiation, easy to remove, no degumming, no residue, and excellent die-cutting processability.
